Electronics
| Process | Outer Layers & Soldermask / PSR |
| Exposure Area | Up to 711mm x 610mm | Up to 28” x 24” |
| Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask : min Dam 60µm | 2.4mil |
| Light Engine | LedLight™ OptiLight™ |
| 'Panel Thickness | 0.05mm to 6mm | 0.002” to 0.236” |
| 'Light Engine | LED Light source LedLight™ |
| 'Collimation | ≤ 1.6° |
| 'Dry Film Resist | For all types of dry film |
| 'Exposure Method | Single side 1 + single side 2 |
| 'Exposure Contact | Soft or hard contact vacuum |
| 'Alignment | ±8μm | 0.32mil AW/Panel (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
| 'CCD Cameras | 4 cameras per exposure station |
| 'Throughput | Up to 4 panels/minute (dry film) |
| 'Batch Changeover | < 2 minutes per station - Artwork change and cleaning, job setting update |
| 'Construction | Stainless steel |
| 'Software | Altix Suite with 17” touch screen |
| 'Air Cleanliness | Hepa filter class 100 |
| 'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
| Process | Outer Layers & Soldermask / PSR |
| Exposure Area | Up to 711mm x 610mm | Up to 28” x 24” |
| Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask : min Dam 60µm | 2.4mil |
| Light Engine | LedLight™ OptiLight™ |
| 'Panel Thickness | 0.05mm to 6mm | 0.002” to 0.236” |
| 'Light Engine | High pressure mercury lamp OptiLight™ |
| 'Collimation | <10° |
| 'Dry Film Resist | For all types of dry film |
| 'Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
| 'Exposure Method | Single side 1 + single side 2 |
| 'Exposure Contact | Soft or hard contact vacuum |
| 'Alignment | ±8μm | 0.32mil AW/Panel (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
| 'CCD Cameras | 4 cameras per exposure station |
| 'Throughput | Up to 3 panels/minute depending on SM ink (mJ) |
| 'Batch Changeover | < 2 minutes per station - Artwork change and cleaning, job setting update |
| 'Construction | Stainless steel |
| 'Software | Altix Suite with 17” touch screen |
| 'Air Cleanliness | Hepa filter class 100 |
| 'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
| Process | Inner Layers, Outer Layers & Soldermask / PSR |
| Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
| Resolution | Dry Film : 20µm/20µm | 0.8mil/0.8mil (Line & Space) Soldermask : min Dam 25µm | 1mil |
| Light Engine | ALDS-Power4+™ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
| 'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
| 'Light Engine | LED Light source ALDS-Power4+™ |
| 'Edge Roughness | ±1,5µm | ±0.05mil |
| 'Depth of Focus | 200µm | 8mils |
| 'Autofocus | ±8mm | ±315mils |
| 'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
| 'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
| 'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
| 'Throughput | 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads |
| Integrated Automation for Fully-Automatic Direct Imaging Process | |
| Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
| Inline or Stand Alone solution / Pass Through side by side or Flip double side Production | |
| Multibatch mode / High mix & medium volume | |
| Dedicated for all resists : Dry Film & Soldermask / PSR | |
| 'Panel Thickness | 0,04 to 6mm |
| 'Light Engine | ALDS-Power4+™ |
| 'Edge Roughness | ± 1,5µm |
| 'Depth of Focus | ± 100µm |
| 'Autofocus | Dynamic AF sensor per Head, stroke of ± 2 mm |
| 'Alignment | ± 12µm Side to Side Alignment ± 8µm Image to Panel (holes or pads) |
| 'CCD Cameras | Side to Side Alignment : 3 cameras Image to Panel Alignment : 2 cameras Image calibration : 1 camera |
| Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
| Modus AAA... to BBB... with intermediate buffer |
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| Multibatch | |
| Dedicated for all resists : Dry Film & Soldermask | |
| 'Panel Thickness | 0.05mm ~ 3.2mm (Optional 5mm) |
| 'Throughput | Cycle time 25 sec per side |
| 'Sensors | Integrated, intelligent double board detection Integrated interleave (slip sheet) detection |
| 'Double side | Flipping station with handshake |