Electronics
Process | Outer Layers & Soldermask / PSR |
Exposure Area | Up to 711mm x 610mm | Up to 28” x 24” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask : min Dam 60µm | 2.4mil |
Light Engine | LedLight™ OptiLight™ |
'Panel Thickness | 0.05mm to 6mm | 0.002” to 0.236” |
'Light Engine | LED Light source LedLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Exposure Method | Single side 1 + single side 2 |
'Exposure Contact | Soft or hard contact vacuum |
'Alignment | ±8μm | 0.32mil AW/Panel (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras per exposure station |
'Throughput | Up to 4 panels/minute (dry film) |
'Batch Changeover | < 2 minutes per station - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Process | Outer Layers & Soldermask / PSR |
Exposure Area | Up to 711mm x 610mm | Up to 28” x 24” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask : min Dam 60µm | 2.4mil |
Light Engine | LedLight™ OptiLight™ |
'Panel Thickness | 0.05mm to 6mm | 0.002” to 0.236” |
'Light Engine | High pressure mercury lamp OptiLight™ |
'Collimation | <10° |
'Dry Film Resist | For all types of dry film |
'Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Single side 1 + single side 2 |
'Exposure Contact | Soft or hard contact vacuum |
'Alignment | ±8μm | 0.32mil AW/Panel (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras per exposure station |
'Throughput | Up to 3 panels/minute depending on SM ink (mJ) |
'Batch Changeover | < 2 minutes per station - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Process | Inner Layers, Outer Layers & Soldermask / PSR |
Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
Resolution | Dry Film : 20µm/20µm | 0.8mil/0.8mil (Line & Space) Soldermask : min Dam 25µm | 1mil |
Light Engine | ALDS-Power4+™ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
'Light Engine | LED Light source ALDS-Power4+™ |
'Edge Roughness | ±1,5µm | ±0.05mil |
'Depth of Focus | 200µm | 8mils |
'Autofocus | ±8mm | ±315mils |
'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
'Throughput | 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads |
Integrated Automation for Fully-Automatic Direct Imaging Process | |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Inline or Stand Alone solution / Pass Through side by side or Flip double side Production | |
Multibatch mode / High mix & medium volume | |
Dedicated for all resists : Dry Film & Soldermask / PSR | |
'Panel Thickness | 0,04 to 6mm |
'Light Engine | ALDS-Power4+™ |
'Edge Roughness | ± 1,5µm |
'Depth of Focus | ± 100µm |
'Autofocus | Dynamic AF sensor per Head, stroke of ± 2 mm |
'Alignment | ± 12µm Side to Side Alignment ± 8µm Image to Panel (holes or pads) |
'CCD Cameras | Side to Side Alignment : 3 cameras Image to Panel Alignment : 2 cameras Image calibration : 1 camera |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Modus AAA... to BBB... with intermediate buffer |
|
Multibatch | |
Dedicated for all resists : Dry Film & Soldermask | |
'Panel Thickness | 0.05mm ~ 3.2mm (Optional 5mm) |
'Throughput | Cycle time 25 sec per side |
'Sensors | Integrated, intelligent double board detection Integrated interleave (slip sheet) detection |
'Double side | Flipping station with handshake |
Adix Units can be incorporated with various Customized "Smart Automation" solutions in order to allow full automatic operation | |
Customized Solutions fit all specific Customer needs and are adequate for small lot sizes, high mix and high volume production |
Photo Chemical Milling
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 300 x 650mm | Up to 11.8” x 25.6” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (Line & Space) Soldermask : min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source ColliLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Coverlay / Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 300 x 650mm | Up to 11.8” x 25.6” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (Line & Space) Soldermask : min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source LedLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Coverlay / Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
Process | Inner Layers, Outer Layers & Soldermask / PSR |
Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
Resolution | Dry Film : 20µm/20µm | 0.8mil/0.8mil (Line & Space) Soldermask : min Dam 25µm | 1mil |
Light Engine | ALDS-Power4+™ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
'Light Engine | LED Light source ALDS-Power4+™ |
'Edge Roughness | ±1,5µm | ±0.05mil |
'Depth of Focus | 200µm | 8mils |
'Autofocus | ±8mm | ±315mils |
'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
'Throughput | 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads |
Process | Inner Layer, Outer Layer & Soldermask / PSR |
Exposure Area | Up to 2 x 635 x 762mm | 2 x 25 x 30’’ |
Resolution | Dry film :10µm/10µm | 0.4/0.4 mil (L&S) Soldermask : min DAM 50µm | 2 mil |
Light Engine | BeamLight™ Multi Channel - 4 Wavelengths ALDS-Power4™ High UV Power with 4 LEDs per Photo Head |
'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
'Light Engine | LED Light source ALDS-Power4™ |
'Edge Roughness | ±2,5µm | ±0.09mil |
'Depth of Focus | ±200µm | ±8mils |
'Autofocus | ±8mm | ±315mils |
'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
'Imaging Resist Materials | All Solder & Conventional Dry Film Resists |
'Exposure Method | Real Time Scaling & Partitioning with all kinds of fiducials |
'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
'Throughput | 65s with 300mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 5 Heads |
'Construction | Stainless steel |
'Software | Altix Suite with 22” touch screen |
'Data Input | Extended Gerber, ODB++ (others upon request) |
'Air Cleanliness | Hepa filter class 100 |
'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Integrated Automation for Fully-Automatic Direct Imaging Process | |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Inline or Stand Alone solution / Pass Through side by side or Flip double side Production | |
Multibatch mode / High mix & medium volume | |
Dedicated for all resists : Dry Film & Soldermask / PSR | |
'Panel Thickness | 0,04 to 6mm |
'Light Engine | ALDS-Power4+™ |
'Edge Roughness | ± 1,5µm |
'Depth of Focus | ± 100µm |
'Autofocus | Dynamic AF sensor per Head, stroke of ± 2 mm |
'Alignment | ± 12µm Side to Side Alignment ± 8µm Image to Panel (holes or pads) |
'CCD Cameras | Side to Side Alignment : 3 cameras Image to Panel Alignment : 2 cameras Image calibration : 1 camera |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Modus AAA... to BBB... with intermediate buffer |
|
Multibatch | |
Dedicated for all resists : Dry Film & Soldermask | |
'Panel Thickness | 0.05mm ~ 3.2mm (Optional 5mm) |
'Throughput | Cycle time 25 sec per side |
'Sensors | Integrated, intelligent double board detection Integrated interleave (slip sheet) detection |
'Double side | Flipping station with handshake |
Adix Units can be incorporated with various Customized "Smart Automation" solutions in order to allow full automatic operation | |
Customized Solutions fit all specific Customer needs and are adequate for small lot sizes, high mix and high volume production |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 550 x 650mm | Up to 21.6” x 25.6” |
Resolution | Dry Film: 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask: min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source LedLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Soldermask / PSR / Sheet to Roll | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Air Cleanliness | Hepa filter class 100 |
' |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 550 x 650mm | Up to 21.6” x 25.6” |
Resolution | Dry Film: 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask: min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source ColliLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Soldermask / PSR / Sheet to Roll | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Air Cleanliness | Hepa filter class 100 |
Photovoltaics
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 300 x 650mm | Up to 11.8” x 25.6” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (Line & Space) Soldermask : min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source ColliLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Coverlay / Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 300 x 650mm | Up to 11.8” x 25.6” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (Line & Space) Soldermask : min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source LedLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Coverlay / Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
Process | Inner Layers, Outer Layers & Soldermask / PSR |
Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
Resolution | Dry Film : 20µm/20µm | 0.8mil/0.8mil (Line & Space) Soldermask : min Dam 25µm | 1mil |
Light Engine | ALDS-Power4+™ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
'Light Engine | LED Light source ALDS-Power4+™ |
'Edge Roughness | ±1,5µm | ±0.05mil |
'Depth of Focus | 200µm | 8mils |
'Autofocus | ±8mm | ±315mils |
'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
'Throughput | 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads |
Integrated Automation for Fully-Automatic Direct Imaging Process | |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Inline or Stand Alone solution / Pass Through side by side or Flip double side Production | |
Multibatch mode / High mix & medium volume | |
Dedicated for all resists : Dry Film & Soldermask / PSR | |
'Panel Thickness | 0,04 to 6mm |
'Light Engine | ALDS-Power4+™ |
'Edge Roughness | ± 1,5µm |
'Depth of Focus | ± 100µm |
'Autofocus | Dynamic AF sensor per Head, stroke of ± 2 mm |
'Alignment | ± 12µm Side to Side Alignment ± 8µm Image to Panel (holes or pads) |
'CCD Cameras | Side to Side Alignment : 3 cameras Image to Panel Alignment : 2 cameras Image calibration : 1 camera |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Modus AAA... to BBB... with intermediate buffer |
|
Multibatch | |
Dedicated for all resists : Dry Film & Soldermask | |
'Panel Thickness | 0.05mm ~ 3.2mm (Optional 5mm) |
'Throughput | Cycle time 25 sec per side |
'Sensors | Integrated, intelligent double board detection Integrated interleave (slip sheet) detection |
'Double side | Flipping station with handshake |
Adix Units can be incorporated with various Customized "Smart Automation" solutions in order to allow full automatic operation | |
Customized Solutions fit all specific Customer needs and are adequate for small lot sizes, high mix and high volume production |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 550 x 650mm | Up to 21.6” x 25.6” |
Resolution | Dry Film: 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask: min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source LedLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Soldermask / PSR / Sheet to Roll | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Air Cleanliness | Hepa filter class 100 |
' |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 550 x 650mm | Up to 21.6” x 25.6” |
Resolution | Dry Film: 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask: min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source ColliLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Soldermask / PSR / Sheet to Roll | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Air Cleanliness | Hepa filter class 100 |
Touch Panel
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 300 x 650mm | Up to 11.8” x 25.6” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (Line & Space) Soldermask : min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source ColliLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Coverlay / Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 300 x 650mm | Up to 11.8” x 25.6” |
Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (Line & Space) Soldermask : min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source LedLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Coverlay / Soldermask / PSR | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Construction | Stainless steel |
'Software | Altix Suite with 17” touch screen |
'Air Cleanliness | Hepa filter class 100 |
Process | Inner Layers, Outer Layers & Soldermask / PSR |
Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
Resolution | Dry Film : 20µm/20µm | 0.8mil/0.8mil (Line & Space) Soldermask : min Dam 25µm | 1mil |
Light Engine | ALDS-Power4+™ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
'Light Engine | LED Light source ALDS-Power4+™ |
'Edge Roughness | ±1,5µm | ±0.05mil |
'Depth of Focus | 200µm | 8mils |
'Autofocus | ±8mm | ±315mils |
'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
'Throughput | 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads |
Integrated Automation for Fully-Automatic Direct Imaging Process | |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Inline or Stand Alone solution / Pass Through side by side or Flip double side Production | |
Multibatch mode / High mix & medium volume | |
Dedicated for all resists : Dry Film & Soldermask / PSR | |
'Panel Thickness | 0,04 to 6mm |
'Light Engine | ALDS-Power4+™ |
'Edge Roughness | ± 1,5µm |
'Depth of Focus | ± 100µm |
'Autofocus | Dynamic AF sensor per Head, stroke of ± 2 mm |
'Alignment | ± 12µm Side to Side Alignment ± 8µm Image to Panel (holes or pads) |
'CCD Cameras | Side to Side Alignment : 3 cameras Image to Panel Alignment : 2 cameras Image calibration : 1 camera |
Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
Modus AAA... to BBB... with intermediate buffer |
|
Multibatch | |
Dedicated for all resists : Dry Film & Soldermask | |
'Panel Thickness | 0.05mm ~ 3.2mm (Optional 5mm) |
'Throughput | Cycle time 25 sec per side |
'Sensors | Integrated, intelligent double board detection Integrated interleave (slip sheet) detection |
'Double side | Flipping station with handshake |
Adix Units can be incorporated with various Customized "Smart Automation" solutions in order to allow full automatic operation | |
Customized Solutions fit all specific Customer needs and are adequate for small lot sizes, high mix and high volume production |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 550 x 650mm | Up to 21.6” x 25.6” |
Resolution | Dry Film: 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask: min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source LedLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Soldermask / PSR / Sheet to Roll | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Air Cleanliness | Hepa filter class 100 |
' |
Process | Inner Layers, Outer Layers & Coverlay / Soldermask / PSR |
Exposure Area | Up to 550 x 650mm | Up to 21.6” x 25.6” |
Resolution | Dry Film: 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask: min Dam 50µm | 2mil |
Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
'Web Thickness | Down to 15µm | 0.6mil |
'Light Engine | LED Light source ColliLight™ |
'Collimation | ≤ 1.6° |
'Dry Film Resist | For all types of dry film |
'Soldermask / PSR / Sheet to Roll | For all types of solder resist: green, white, blue, red, black… |
'Exposure Method | Double side or single side |
'Alignment | ±5μm | 0.2mil AW/AW (after vacuum) ±8μm | 0.32mil AW/Web (after vacuum) ±3μm | 0.12mil Repeatability (after vacuum) |
'CCD Cameras | 4 cameras for I/L & O/L 4 cameras + 4 cameras for Coverlay / Soldermask / PSR |
'Throughput | Up to 8000 images/day |
'Batch Changeover | ≤ 5 minutes - Artwork change and cleaning, job setting update |
'Air Cleanliness | Hepa filter class 100 |
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