Adix Supra
Direct Imaging for IC Substrate & Advanced Packaging
Adix Supra is a UV LED Direct Imaging system designed for IC substrate and advanced semiconductor packaging applications.
Based on Altix imaging technology, the system delivers high-resolution imaging and stable process control for demanding production environments.
Adix Supra supports next-generation packaging processes requiring high precision and reliable imaging performance.
The system is designed for 6 µm Line & Space capability, with mass production performance at 8/12 µm L/S.
Main characteristics
| Applications | FOPLP, FOWLP, FCBGA, FCCSP |
| Exposure Area | Up to 600x600mm | Up to 23.6''x23.6'' |
| Resolution | 6 µm Line & Space capability, mass production L/S=8/12 µm |
| Light Engine | UV LED technology |
| Photo Heads | Up to 6 |
| UV Power | 4 LEDs per photo head |
Altix worldwide !
