Semi-Automatic

Afosa

Panel / Sheet Semi-Automatic

Afosa is designed as a single and/or double-sided semi-automatic UV exposure system, including LEDs, for fine line resolution on dry film and liquid soldermask.

Main characteristics
Process Inner Layers, Outer Layers & Soldermask / PSR
Exposure Area Up to 610mm x 762mm | Up to 24” x 30”
Resolution Dry Film : 15µm/15µm | 0.6mil/0.6mil (Line & Space)
Soldermask : min Dam 50µm | 2mil
Light Engine LedLight™
Mach3®LedLight™
ColliLight™ 5kW & 8kW

'Panel thickness 0.05mm to 6mm | 0.002” to 0.236”
'Light Engine High pressure mercury lamp
ColliLight™ 5kW & 8kW
'Collimation ≤ 1.5°
'Dry Film Resist For all types of dry film
'Soldermask / PSR For all types of solder resist: green, white, blue, red, black…
'Exposure Method Double side
'Exposure Contact Soft or hard contact vacuum - CMI™ available for Afosa s
'Alignment ±15μm | 0.6mil AW/AW
±20μm | 0.8mil AW/Panel
'CCD Cameras 4 cameras (bottom side)
'Throughput Up to 2 panels/minute for I/L mode
'Batch Changeover ≤ 4 minutes - Artwork change and cleaning, job setting update
'Panel Thickness 0.05mm to 6mm | 0.002” to 0.236”
'Light Engine LED Light source
LedLight™
'Collimation ≤ 1.6°
'Dry Film Resist For all types of dry film
'Exposure Method Double side
'Exposure Contact Soft or hard contact vacuum - CMI™ available for Afosa s
'Alignment ±15μm | 0.6mil AW/AW
±20μm | 0.8mil AW/Panel
'CCD Cameras 4 cameras (bottom side)
'Throughput Up to 2 panels/minute for I/L mode
'Batch Changeover ≤ 4 minutes - Artwork change and cleaning, job setting update
'Panel Thickness 0.05mm to 6mm | 0.002” to 0.236”
'Light Engine 3 LED Light source
LedLight™ Mach3® - High power & triple wavelength led light source
'Collimation ≤ 1.6°
'Soldermask / PSR For all types & colors of ink: green, white, blue, red, black…
'Exposure Method Single side - Upper side exposure
'Exposure Contact Soft or hard contact vacuum - CMI™ available for Afosa s
'Alignment ±12μm | 0.5mil AW/Panel (copper pad fiducials)
'CCD Cameras 4 cameras (upper side) - All movable independently
'Throughput Up to 2 sides/minute for energy within 700mJ/cm2
'Batch Changeover ≤ 4 minutes - Artwork change and cleaning, job setting update
'Safety Safety light curtain
'Double Drawers Same height for both operating trays
'Process Inner Layers, Outer Layers & Soldermask / PSR
'Exposure Area Up to 610mm x 762mm | Up to 24” x 30”
'Resolution Dry Film: 15µm/15µm | 0.6mil/0.6mil (Line & Space)
Soldermask: Min Dam 50µm | 2mil
'Light Engine LedLight™
Mach3®LedLight™
ColliLight™ 5kW & 8kW

More infos

Adix SA

Panel / Sheet Semi-Automatic

Adix SA is an UV LED DMD Direct Imaging solution for all Direct Imaging applications based on its new ALDS-Power4+™ technology with 4 LEDs per photo head.
The solution is dedicated to high mix low and medium volume production.

Main characteristics
Process Inner Layers, Outer Layers & Soldermask / PSR
Exposure Area From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30”
Resolution Dry Film : 20µm/20µm | 0.8mil/0.8mil (Line & Space)
Soldermask : min Dam 25µm | 1mil
Light Engine ALDS-Power4+™ Data preprocessing in hidden time
High UV Power with 4 LEDs per Photo Head
'Panel Thickness 0.04mm to 6mm | 0.0016” to 0.236”
'Light Engine LED Light source
ALDS-Power4+™
'Edge Roughness ±1,5µm | ±0.05mil
'Depth of Focus 200µm | 8mils
'Autofocus ±8mm | ±315mils
'Exposure Spectrum 4 LEDs wavelengths per Photo Head: 365/380/395/405nm
'Alignment ±8μm | 0.3mil (Image to Panel Registration)
±12μm | 0.5mil (Side to Side Registration)
'CCD Cameras 2 Cameras
- for Outer Layers (Alignment on 4 Holes)
- for Soldermask Registration (Alignment on 4 Copper Targets)
3 Cameras
- for Inner Layers (Alignment on 3 Fiducials)
'Throughput 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads
'Panel Thickness 0.04mm to 6mm | 0.0016” to 0.236”
'Light Engine LED Light source
ALDS-Power4™
'Edge Roughness ±1,5µm | ±0.05mil
'Depth of Focus ±100µm | ±4mils
'Autofocus ±8mm | ±315mils
'Exposure Spectrum 4 LEDs wavelengths per Photo Head: 365/380/395/405nm
'Imaging Resist Materials Conventional & DI/LDI Specific Dry Film, Ink & Solder Resists
'Exposure Method Real Time Scaling & Partitioning with all kinds of fiducials
'Alignment ±8μm | 0.3mil (Image to Panel Registration)
±12μm | 0.5mil (Side to Side Registration)
'CCD Cameras 2 Cameras
- for Outer Layers (Alignment on 4 Holes)
- for Soldermask Registration (Alignment on 4 Copper Targets)
3 Cameras
- for Inner Layers (Alignment on 3 Fiducials)
'Throughput 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads
'Construction Stainless steel
'Software Altix Suite with 22” touch screen
'Data Input Extended Gerber, ODB++ (others upon request)
'Air Cleanliness Hepa filter class 100
'Languages English, Simplified & Traditional Chinese, Korean, German, French…
'Process Inner Layers, Outer Layers & Soldermask / PSR
'Exposure Area From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30”
'Resolution Dry Film: 10µm/10µm | 0.4mil/0.4mil (Line & Space)
Soldermask: Min Dam 25µm | 1mil
'Light Engine ALDS-Power4+™ Data preprocessing in hidden time
High UV Power with 4 LEDs per Photo Head

More infos

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