Adix Supra

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Direct Imaging for IC Substrate & Advanced Packaging

Adix Supra is a UV LED Direct Imaging system designed for IC substrate and advanced semiconductor packaging applications.

Based on Altix imaging technology, the system delivers high-resolution imaging and stable process control for demanding production environments.

Adix Supra supports next-generation packaging processes requiring high precision and reliable imaging performance.

The system is designed for 6 µm Line & Space capability, with mass production performance at 8/12 µm L/S.

Benefits & exclusive features

• ALDS-Power4+™ UV LED Imaging Technology : High UV power and excellent depth of focus enabling high-precision imaging for advanced packaging applications.
• Up to 6 Photo Heads : Flexible system configuration allowing productivity adaptation to different production requirements.
• Advanced Positioning Software (DPC) : Precise die location positioning ensuring accurate alignment for semiconductor substrates.
• Optimized Thermal Regulation : Stable temperature control for consistent imaging performance during production. 
• Intuitive HMI Interface : Simple machine operation and improved production efficiency.

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