Adix SA

Panel / Sheet Semi-Automatic

Adix SA is an UV LED DMD Direct Imaging solution for all Direct Imaging applications based on its new ALDS-Power4™ technology with 4 LEDs per photo head.
The solution is dedicated to high mix low and medium volume production.

It can handle all types of rigid or flex material, PCB, FPC, Metal Etching, Touch Panel… for all processes and was designed to reach the best-cost performance ratio.

Benefits & exclusive features

Semi-Automatic Direct Imaging exposer dedicated to Inner Layers, Outer Layers, Soldermask / PSR

  • Non-movable photo heads
  • Flexible technology upgradable on site : photo heads can be added at any time 
  • Highly engineered temperature regulation
  • Fast and easy LED replacement
  • 4 side panel auto mechanical clamping system
  • Fast preprocessing service in hidden time
  • Vision lighting designed for different materials and finishing
  • Traceability : serial, date, QR code…
  • Partitioning mode for multi panel printing
  • Machine built with appropriate selection of material
  • All in one built-in system
  • Etching offset : possible to adapt the size of printed graphic objects
  • Adjustable panel vacuum strength
  • Automatic vacuum fitting all size of panels 
  • Front to back registration without UV lasers
  • Edge/corner panel detection

Documentation:
Adix SA ALDS-Power4™ I/L-O/L, SM/PSR


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Process Inner Layers, Outer Layers & Soldermask / PSR
Exposure Area From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30”
Resolution Dry Film : 25µm/25µm | 1mil/1mil (L&S)
Soldermask : min Dam 25µm | 1mil
Light Engine ALDS-Power4™
High UV Power with 4 LEDs per Photo Head

Models

Documentation

Panel Thickness 0.04mm to 6mm | 0.0016” to 0.236”
Light Engine LED Light source
ALDS-Power4™
Edge Roughness ±1,5µm | ±0.05mil
Depth of Focus ±100µm | ±4mils
Autofocus ±8mm | ±315mils
Exposure Spectrum 4 LEDs wavelengths per Photo Head: 365/380/395/405nm
Imaging Resist Materials Conventional & DI/LDI Specific Dry Film, Ink & Solder Resists
Exposure Method Real Time Scaling & Partitioning with all kinds of fiducials
Alignment ±8μm | 0.3mil (Image to Panel Registration)
±12μm | 0.5mil (Side to Side Registration)
CCD Cameras 2 Cameras
- for Outer Layers (Alignment on 4 Holes)
- for Soldermask Registration (Alignment on 4 Copper Targets)
3 Cameras
- for Inner Layers (Alignment on 3 Fiducials)
Throughput 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads
Construction Stainless steel
Software Altix Suite with 22” touch screen
Data Input Extended Gerber, ODB++ (others upon request)
Air Cleanliness Hepa filter class 100
Languages English, Simplified & Traditional Chinese, Korean, German, French…

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