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Process Outer Layers & Soldermask / PSR
Exposure Area Up to 711mm x 610mm | Up to 28” x 24”
Resolution Dry Film : 15µm/15µm | 0.6mil/0.6mil (L&S)
Soldermask : min Dam 60µm | 2.4mil
Light Engine LedLight™
OptiLight™
'Panel Thickness 0.05mm to 6mm | 0.002” to 0.236”
'Light Engine LED Light source
LedLight™
'Collimation ≤ 1.6°
'Dry Film Resist For all types of dry film
'Exposure Method Single side 1 + single side 2
'Exposure Contact Soft or hard contact vacuum
'Alignment ±8μm | 0.32mil AW/Panel (after vacuum)
±3μm | 0.12mil Repeatability (after vacuum)
'CCD Cameras 4 cameras per exposure station
'Throughput Up to 4 panels/minute (dry film)
'Batch Changeover < 2 minutes per station - Artwork change and cleaning, job setting update
'Construction Stainless steel
'Software Altix Suite with 17” touch screen
'Air Cleanliness Hepa filter class 100
'Languages English, Simplified & Traditional Chinese, Korean, German, French…
Process Outer Layers & Soldermask / PSR
Exposure Area Up to 711mm x 610mm | Up to 28” x 24”
Resolution Dry Film : 15µm/15µm | 0.6mil/0.6mil (L&S)
Soldermask : min Dam 60µm | 2.4mil
Light Engine LedLight™
OptiLight™
'Panel Thickness 0.05mm to 6mm | 0.002” to 0.236”
'Light Engine High pressure mercury lamp
OptiLight™
'Collimation <10°
'Dry Film Resist For all types of dry film
'Soldermask / PSR For all types of solder resist: green, white, blue, red, black…
'Exposure Method Single side 1 + single side 2
'Exposure Contact Soft or hard contact vacuum
'Alignment ±8μm | 0.32mil AW/Panel (after vacuum)
±3μm | 0.12mil Repeatability (after vacuum)
'CCD Cameras 4 cameras per exposure station
'Throughput Up to 3 panels/minute depending on SM ink (mJ)
'Batch Changeover < 2 minutes per station - Artwork change and cleaning, job setting update
'Construction Stainless steel
'Software Altix Suite with 17” touch screen
'Air Cleanliness Hepa filter class 100
'Languages English, Simplified & Traditional Chinese, Korean, German, French…
制程应用 内层,外层,防焊/ PSR
曝光面积 从228 x 254mm到610 x 762mm |从 9” x 10”到24” x 30”
解析度 干膜 : 20µm/20µm |0.8mil/0.8mil (线宽线距)
阻焊桥最小可达25µm | 1mi
光源 ALDS-Power4+™ 极短的数据预处理时间
高功率 UV –LED,每个成像头配置4个LED
'板厚 0.04mm 到 6mm | 0.0016” 到 0.236”
'光源 LED光源
ALDS-Power4+™
'边缘粗糙度 ±1,5µm | ±0.05mil
'景深 200µm | 8mils
'自动对焦 ±8mm | ±315mils
'曝光光谱 每个成像头配置4波长LED光源:365/380/395/405nm
'对位精度 ±8μm | 0.3mil (片对板对位精度)
±12μm | 0.5mil (层间对位精度)
'CCD摄像头 2个CCD摄像头 -外层( 4个通孔靶标对位)
-防焊对位精度(4个铜箔靶标对位)
3个CCD摄像头-内层(3个光学靶标对位)
'产能 14秒:30mJ/cm2曝光能量为基准,成像尺寸457 x 610mm (18’’x 24’’) ,使用6个成像头
全自动直接成像系统
最大610 x 610mm /单面10秒
内联或独立解决方案/并排通过或翻转双面生产
轻松应对多料号,少量多样生产模式
适用于各类型干膜,防焊油墨/PSR
'板厚 0.04mm 到 6mm
'光源 ALDS-Power4+™
'边缘粗糙度 ± 1,5µm
'景深 ± 100µm
'自动对焦 每个成像头配动态AF传感器,行程±2mm
'对位精度 ±12μm (层间对位精准度)
±8μm 片对板(孔或pad)
'CCD摄像头 3个CCD摄像头:层间对位精度
2个CCD摄像头: 片对板对位精度
1个CCD摄像头-成像校准
可达 610 x 610mm /10秒完成单面曝光
A面 – B面模式:连续完成A面,利用暂存机构存放,再开始B面曝光作业
轻松应对多料号,少量多样生产模式
适用于各类型干膜和防焊油墨
'板厚 0.05mm ~ 3.2mm ( 5mm可选)
'产能 单面25秒
'传感器 集成智能双板侦测
集成(滑板)侦测
'双面 翻转台面两个手臂交换面板